Information

• January 16, 2025
  (Information) Obtained IATF16949:2016 certification for Die Attach Film for semiconductor produced at the Mie Works

• May 17, 2022
  (News Release) Furukawa Electric to increase production capacity of tape for Semiconductor Process

• April 30, 2021
  Homepage Renewal

• March 25, 2020
  (Update Product) Tape for Backgrinding
• March 25, 2020
  (Update Product) Tape for Dicing

• April 20, 2018
  (New Product) Conductive Dicing Die Attach Film
• April 20, 2018
  (New Product) Backgrinding Tape for High-bumped Wafer
• April 20, 2018
  (New Product) Backgrinding Tape for SDBG/GAL Process

• March 1, 2017
  (News Release) Furukawa Electric Develops New Semiconductor Tape that Can Significantly Improve Semiconductor Quality