Expansion of Supply Capacity for HVLP 4 Copper Foil Used in High-Frequency Circuit Boards for AI Servers

Furukawa Electric Co., Ltd. (Head office: 2-6-4 Otemachi, Chiyoda-ku, Tokyo; President & CEO: Hideya Moridaira) will expand the supply capacity for its F0X-WS foil, an HVLP^(note1)4 grade copper foil (hereinafter “HVLP 4 copper foil”) used in high-frequency circuit boards for AI servers, demand for which is rapidly increasing with the widespread adoption of generative AI. Supply capacity will be expanded at Furukawa Electric’s site in Japan (Nikko City, Tochigi Prefecture) and at Group companies in Taiwan. Through this phased expansion, the Furukawa Electric Group’s supply capacity for HVLP 4 copper foil will increase to approximately twice the level at the end of FY2026 by the end of FY2029. This will enable the Group to meet strong current and future customer requirements and contribute to the growth of the AI and data center markets.

Against the backdrop of the rapid adoption of generative AI, demand remains strong for copper foil used in high-frequency circuit boards that support high-speed, high-capacity signal transmission, and continued strong growth is expected. In particular, adoption of HVLP 4 copper foil is expanding in AI server applications, where reduced transmission loss and high reliability are required.
Furukawa Electric’s copper foil business has responded to this growth by improving the efficiency of production lines at its existing sites and shifting its product portfolio toward high-value-added products. However, demand continues to exceed supply. To meet strong customer expectations, Furukawa Electric will now expand its supply capacity for HVLP 4 copper foil by combining a medium- to long-term product portfolio transformation with increased HVLP 4 copper foil production capacity at each site.

Product: HVLP 4 copper foil for high-frequency circuit boards (Furukawa Electric's F0X-WS foil)
Locations: Furukawa Electric’s site in Japan (Nikko City, Tochigi Prefecture) and Group companies in Taiwan
Scale and timing: Increase HVLP 4 copper foil supply capacity to approximately twice the level at the end of FY2026 by the end of FY2029

Building on more than half a century of electrolytic copper foil manufacturing technology, Furukawa Electric provides copper foil that reduces transmission loss in the high-frequency range through its proprietary surface treatment technology, developed through co-creation with its customers, copper clad laminate (CCL) manufacturers.
By expanding its HVLP 4 copper foil supply capacity, Furukawa Electric will further increase the proportion of high-value-added products and expand business profit. At the same time, Furukawa Electric will advance preparations for the launch of next-generation copper foil for high-frequency circuit boards, commonly referred to as HVLP 5 grade, thereby contributing to the growth of the rapidly expanding AI and data center markets.

Leveraging our 4 core technologies of metals, polymers, photonics and high frequency, Furukawa Electric Group operates a wide range of businesses in fields including infrastructure such as telecommunications and energy, automotive systems and electronics. Based on our Purpose of "Composing the core of a brighter world", we strive to solve social issues such as supporting faster optical communications, addressing carbon neutrality and evolving mobility, and contribute to the establishment and development of next-generation infrastructure.