Furukawa Electric Develops Low-Young’s-Modulus, Heat-Resistant Oxygen-Free Copper “TOFC™”
(Furukawa Electric News Release, November 27, 2025)

February 20, 2026

Furukawa Electric Develops Low-Young’s-Modulus, Heat-Resistant Oxygen-Free Copper “TOFC™”
- Contributing to the enhanced performance of power semiconductor modules by low Young’s modulus, high heat resistance, and high thermal conductivity -
(Furukawa Electric News Release, November 27, 2025)

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